IPC Executive Forum on Advancing Automotive Electronics


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Register early for IPC's Executive Forum on Advancing Automotive Electronics and receive a 20% discount. You must register before December 21 to receive the discount.

This not-to-be-missed event on January 28, 2019 at IPC APEX EXPO 2019 is designed for executives in the global electronics systems supply chain. The forum features such worldwide notables as Dr. Udo Welzel, team leader of automotive electronics, engineering assembly and interconnect technology at Robert Bosch GmbH, who will present "Enabling Connected, Electrified and Automated Mobility: Challenges for Assembly and Interconnect Technology.” Also featured is Alex Stepinski, vice president of GreenSource Fabrication LLC, with Jochen Zeller, managing director of AWP GmbH, who will discuss the world's first “green” 4.0 PCB fabrication facility with single piece flow in-line automated facility with 100% layer traceability for advanced HDI/IC substrate/FPC production, plus its implications for automotive electronics. 

Bob Neves, chairman/CTO of Microtek Labs China and member of the IPC's board of directors, will present "PCB Reliability Testing for Automotive Electronics—The China Story." Joe D'Ambrisi, senior vice president of MacDermid Alpha Electronics Solutions, will present "The Global Outlook for Specialty Chemicals & Materials in Automotive Electronic Packaging."

Carlo Favini, founder of Elga Europe will present "Developing a New Dry Film Photoresist to Meet Automotive Very Fine Line Circuit Needs - a Multicompany-Multinational Cooperative Program" (co-authored with Giorgio Favini, CEO Elga Europe).

Dwight Howard, manager, electrical engineering, North America & Asia-Pacific product development infotainment and driver information (IDI) PBU, electronics & safety division, APTIV LLC (formerly Delphi Automotive Systems IDI/NA Division) will discuss "Integrated Intelligent Transportation and Key Enablers."

Randy Hierbaum, vice president of sales, Optimal+, will present "Striving for Zero DPPM." He will discuss working on quality excellence programs with a Tier 1 provider while improving process cycle times. Alun Morgan, technology ambassador of Ventec and Chairman of the EIPC, will discuss providing a simple and universal adoption route for all suppliers with "Developing Universal Solutions to Automotive Materials Challenges."

Larry Wilson III, leader of Nexteer's Automotive Global Electronics Costing Team, will discuss creating cost models with suppliers and investing costs of new technologies. He will provide forecasts of future costs of automotive electronics.

Dr. John Mitchell, IPC president and CEO, will initiate the meeting with a high level, presentation, "Freeway to the Future: Automotive Elecronics Past/Present/Future."

For further information contact forum chairman Gene Weiner or Tracy Riggan, senior director, member support.

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