FIDELITAS Acquires ERNI Group's EMS Business


Reading time ( words)

The ERNI Group, headquartered in Bruttisellen (CH), has sold the electronic manufacturing services (EMS) and central electrics business of ERNI Electronic Solutions GmbH & Co. KG, with around 60 employees, to FIDELITAS Industrieholding GmbH, Nurtingen.

As a subsidiary of FIDELITAS, INTUS Elektronik GmbH will continue the business operations in Goppingen-Eschenbach without restrictions and take over the employees. The main assets of ERNI Electronics Solutions GmbH & Co. KG were acquired as part of an asset deal.

The new Managing Director of INTUS Elektronik GmbH is Patrick Minsch, who has been successfully contributing to the operative business since mid-2017. Dr. Matthias Maier, who is responsible for the business of the INTUS parent company FIDELITAS, will support him during the transition period.

"With FIDELITAS, we are pleased to have found a buyer that on the one hand has a high level of industry expertise and on the other hand will further develop the EMS business as a strategic addition.” Rudolf Hausladen, CEO of the ERNI Group, explains the transaction. As a leading manufacturer of electronic connectivity solutions with a global network, ERNI's focus is on the automotive industry and industrial automation.

The FIDELITAS Industrieholding GmbH, Nurtingen, realizes company successions in South German mid-sized companies and has focused on companies in special situations. "We are convinced of the manufacturing possibilities and the know-how of the employees", says Dr. Matthias Maier, "and will intensively contribute to the development of the company's activities as a contract manufacturer for electronic applications from the first product idea to series production".

Share

Print


Suggested Items

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.

Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications

11/06/2018 | Ranjit Pandher, et al., Alpha Assembly Solutions
Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.

Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste

09/05/2018 | Patty Goldman, I-Connect007
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.



Copyright © 2018 I-Connect007. All rights reserved.