iNEMI Webinar on Reuse & Recycling Metrics Project

Reading time ( words)

The iNEMI Reuse and Recycling Metrics project team has been developing a practical means for assessing the circular economic value of information and communication technology (ICT) products. The team is proposing to incorporate a score factor metric that assigns reasonable impact value to product design features along with the ability to recover and return scrap value back to the market. Included in this scoring are aspects that are within the product designer’s control—such as material choice and ease of liberation of components and materials—and those aspects outside the product designer’s control — such as the availability of recovery technologies in the markets where the product is placed.

In line with this, iNEMI will be holding an end-of-project webinar on January 23–24, 2019, to review the metric and discuss what is next for the project, including how you can assist with future improvements. This webinar is open to members and non-members. For more details, including registration, click here.


Suggested Items

RTW IPC APEX EXPO 2019: iNEMI on Next-generation Soldering

03/13/2019 | Real Time with...IPC
Grace O’Malley, VP of technical operations at iNEMI, and Editor Nolan Johnson discuss the next-generation soldering buzz session workshop hosted by iNEMI at IPC APEX EXPO 2019 and the upcoming bi-annual technology roadmap that will be released this spring.

Improving Test and Inspection

07/05/2016 | Stephen Las Marias, I-Connect007
In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.

iNEMI: Leading the Way to Successful Electronics Manufacturing

12/28/2015 | Stephen Las Marias, I-Connect007
iNEMI CEO Bill Bader talks about the consortium’s goals and mission, its collaborative projects, as well as its roadmap for the electronics manufacturing industry. Bader also highlights iNEMI’s milestones in line with the major trends that have happened in the electronics industry, including the transition to lead-free, addressing tin whisker growth, and the move towards HFR-free PCB materials.

Copyright © 2022 I-Connect007. All rights reserved.