Alpha Launches Ultra-Low Voiding Solder Paste for Vacuum Solder Reflow


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Alpha Assembly Solutions has recently introduced ALPHA OM-355, designed specifically for vacuum soldering applications.

“Inline vacuum soldering capabilities are becoming more common as power density increases on BGAs and as BTC component packages require effective heat dissipation through void reduction”, said Paul Salerno, global portfolio manager for SMT Solutions at Alpha Assembly Solutions. “This solder paste has an activator system that is optimized for the vacuum soldering reflow process to control the rate of volatilization and reduction in surface tension which allows voids to escape under reducing atmosphere. This promotes ultra-low voiding below 5% without the post-reflow defects commonly associated with vacuum soldering.”

Part of Alpha’s Void Reduction Solutions, ALPHA OM-355 is compatible with SAC305, Innolot and MAXREL Plus alloys.The ALPHA OM-355 MAXREL Plus solder paste is intended for final assemblies in automotive, defense, aerospace, telecommunications, or any device requiring power management and high reliability.

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