Greatest Challenges in Soldering


Reading time ( words)

In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Gebhard Neifer, Delphi: “Customer acceptability criteria regarding void level, in particular for bottom terminated components (BTCs). Odd form components meant to be mounted in a THR/PiP process are limited in size due to constraints in pick-and-place equipment and clearance in reflow ovens. Component mix leads to compromises regarding stencil thickness. We keep pushing the boarder regarding stepped stencils, but still face issues with providing sufficient paste for PiP and have, on the other side, solder bridges under BTCs.”

Allen Bennink, VAL Engineering Sciences Inc.: “Soldering and inspection of leadless parts; BGAs on both sides of flex circuits; and large ground planes on outside layers of boards. I am able to use and prefer OSP finishes. I also use SN100C chemistry almost exclusively—I really dislike SAC.”

Michael Lynn, Colt Tech LLC: “High temperature required for lead free; reworking lead free; and quality of lead free. Our customers are unwilling to pay for the much higher cost of a lead-free process. We need lead in our solder for a reliable solder joint.”

Share

Print


Suggested Items

Industry Outlook from IPC's Sharon Starr

03/18/2019 | Patty Goldman, I-Connect007
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.

RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

03/06/2019 | Real Time with...IPC
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

Two Full CFX Demo Lines at IPC APEX EXPO 2019

03/05/2019 | Dan Feinberg, Technology Editor, I-Connect007
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.



Copyright © 2019 I-Connect007. All rights reserved.