Reading time ( words)
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.
Gebhard Neifer, Delphi: “Customer acceptability criteria regarding void level, in particular for bottom terminated components (BTCs). Odd form components meant to be mounted in a THR/PiP process are limited in size due to constraints in pick-and-place equipment and clearance in reflow ovens. Component mix leads to compromises regarding stencil thickness. We keep pushing the boarder regarding stepped stencils, but still face issues with providing sufficient paste for PiP and have, on the other side, solder bridges under BTCs.”
Allen Bennink, VAL Engineering Sciences Inc.: “Soldering and inspection of leadless parts; BGAs on both sides of flex circuits; and large ground planes on outside layers of boards. I am able to use and prefer OSP finishes. I also use SN100C chemistry almost exclusively—I really dislike SAC.”
Michael Lynn, Colt Tech LLC: “High temperature required for lead free; reworking lead free; and quality of lead free. Our customers are unwilling to pay for the much higher cost of a lead-free process. We need lead in our solder for a reliable solder joint.”
Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”
Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.