Dorigo Systems Utilizes Koh Young’s Data-Driven, Full 3D Inspection System


Reading time ( words)

Dorigo Systems has integrated the Koh Young KY8030-3 solder paste inspection (SPI) and Zenith 3D AOI system into its high speed printed circuit board (PCB) assembly lines providing true 3D optical inspection. Dorigo is one of only a few select EMS providers in Canada that uses a true 3D measuring system providing foreign material inspection for the entire PCBA – vastly improving the ability to detect board defects during the manufacturing process.

“At Dorigo Systems, we continue to adapt our electronics manufacturing processes to achieve close to zero board defects,” states Paul Vasvary, business development manager, Dorigo Systems. “By implementing the Koh Young Technology that analyzes true 3D measurement, Dorigo is building PCBA’s right the first time.”

By accessing all board data, Dorigo Systems uses an inspection solution that collects and analyzes large amounts of data producing traceable results and increasing board quality. The Koh Young KY8030-3 SPI and Zenith 3D AOI system detects all kinds of board defects using patented shadow-free 3D moiré technology including: missing, offset, rotation, polarity, upside down, OCV/OCR, solder filet, billboarding, lifted lead, lifted body, and tombstone bridging.

 “The Zenith series provides superior results by measuring every aspect of the component and solder joint according to IPC-A-610 standards,” says Chas Yu, Dorigo’s quality manager. “By quickly measuring components and solder joints, and then offering critical height information to the inspection algorithms, we can now immediately identify errors like pad overhang and insufficient solder.”

The Koh Young KY8030-3 SPI and Zenith 3D AOI system uses data-driven analytics to overcome production challenges, and enables smart manufacturing for Dorigo Systems' high speed lines, vastly improving board inspection. True 3D optical scanning removes shadow problems by utilizing 8-way projection while providing accurate PCB inspection data with real-time PCB warp compensation.

“When it comes to building high-precision electronics, there is no margin for error,” states Vasvary. “3D optical inspection ensures we continue to provide superior electronics manufacturing services to our customers.”

Share

Print


Suggested Items

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

MTV Offers Solder Paste Testing Solution

06/17/2020 | Nolan Johnson, I-Connect007
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

TQM: The Tyranny of the Urgent

06/10/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.



Copyright © 2020 I-Connect007. All rights reserved.