EMS Installs Second Heller 1809 MKIII


Reading time ( words)

Electronic Manufacturing Solutions Limited (EMS) has installed a second brand new Heller 1809 MKIII Convection Reflow Soldering oven, provided by Zen Production Equipment Ltd, a UK supplier of electronics assembly equipment.

Heller are a leading global supplier of reflow oven equipment, who have been supplying reflow soldering ovens since the 1980s and have won numerous awards for this innovation and continue to invest in cutting edge research.

The 1809 MKIII offers:

  • Integrated user-friendly software with excellent zone and profile control for optimal PCB reflow and control over PCBs and components of almost any design or style
  • 9 top and 9 bottom heating zones, providing a total of 18 heaters, with a heated length of 2,540mm
  • 2 cooling zones, with a cooling length of 660mm
  • Excellent energy efficiency and short heat up times
  • High throughout capability

EMS' General Manager Jonathan Plummer said, "Our second Heller 1809 MKIII is a fantastic investment for EMS, the upgrade on the previous plant is significant across the board with excellent energy efficiency whilst providing an excellent user interface and a massively increased throughput capacity to support our brand-new line installation”.

“The purchase of the 1809 MKIII is key to maximise the potential of our brand new second line installation” said Bernard Chubb, managing director of EMS “we were so happy with the first 1809 MKIII, its flexibility, throughput capacity and consistency that the installation as part of the second line, to allow shared setup with line 1 was an obvious choice”.

Share

Print


Suggested Items

RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530

03/13/2019 | Real Time with...IPC
Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization. Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.

How Inspection Improved the Manufacturing Process

02/27/2019 | I-Connect007 Research Team
In our previous survey, we asked how inspection has helped improve the manufacturing process. Here are just a few of the replies, slightly edited for clarity.

Super Dry Storage Options to Manage Intermetallic Growth

02/11/2019 | Kelly Dack
Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.



Copyright © 2019 I-Connect007. All rights reserved.