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BTU International’s Fred Dimock, manager of process technology, will present during the upcoming SMTA Capital Chapter Meeting. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” at the meeting, scheduled to take place Thursday, January 10, 2019 from 5:00-7:30 p.m. at ZESTRON in Manassas, Virginia.
This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry. Additionally, Dimock will present a report on preliminary data from a void reduction experiment completed at the Universal Instruments Process Laboratory.
Dimock has taught numerous SMTA solder reflow classes and has participated in the 5-45 subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the ‘Handbook of Electronic Assembly’ and ‘A Guide to SMTA Certification’ by Dr. Lasky and Jim Hall.
Dimock holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He is a long-standing member of the SMTA Technical Committee.
Don’t miss out on dinner and a facility tour prior to the presentation. Registration is free for members and $30 for non-members. The registration fee will be waived if you join the Capital Chapter during this event.