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There are just three days left to get a 20% discount to IPC's Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019 in San Diego January 28.
This not-to-be-missed event covers developing specialty chemicals and materials for PCB fabrication and assembly, reliability testing, software, future needs, and the creation of America’s first 4.0 green fabrication facility.
Presentations include "Enabling Connected, Electrified and Automated Mobility: Challenges for Assembly and Interconnect Technology," by Dr. Udo Welzel of Robert Bosch GmbH; and "Integrated Intelligent Transportation and Key Enablers," by Dwight Howard of APTIV LLC.
To register for the Executive Forum on Advancing Automotive Electronics, click here.
For further information, contact forum chairman Gene Weiner at firstname.lastname@example.org or Tracy Riggan, Senior Director, Member Support, at TracyRiggan@ipc.org.
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.