Indium’s Fiona Chen to Present at ELEXCON 2018


Reading time ( words)

Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.              

Chen will present on the topic of Fluxes Suppressing Non-Wet Opens at BGA Assembly. The paper examines the advancement of miniaturization and its impact on the increased severity of thermal warpage and resultant non-wet opens (NWO) at BGA assembly. Chen’s paper studies a “cold-welding barrier” method developed to suppress NWO.

Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She has been with the company since 2008, and has worked on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications. She is also responsible for new technology and new product development. Chen received her bachelor’s degree in chemical engineering in 2005 and her master’s degree in polymer chemistry and physics in 2008 from Suzhou University.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the com

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.



Copyright © 2019 I-Connect007. All rights reserved.