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New and emerging product markets are driving further miniaturization of components, making smaller and thinner packages and boards the norm. These applications also present unique use and environmental conditions. As a result, the electronics manufacturing industry faces additional assembly yield and product reliability challenges. So how can we successfully mitigate these challenges? Modify existing materials and processes? Develop new technologies?
iNEMI will be holding a free workshop that will focus on the future of solder materials and how these materials must advance to meet the needs of new products and processes. Scheduled on January 31, 2019, at the Buzz Session BZ6 of the IPC APEX EXPO 2019, the workshop will be interactive, with speakers, panel sessions and working groups focused on user needs and materials development. The keynote will be delivered by Intel, while speakers and panelists will be from Senju, Alpha Assembly, Henkel, Indium, HP, Dell, Raytheon and John Deere.
The workshop aims to discuss new and future plans of solder materials development in the electronics industry; increase understanding of the processing and reliability challenges encountered when adopting new solder materials; and identify collaborative project opportunities to advance technology development and deployment of next-generation solders.
Let us know if you're coming! For more information or to register, click here.
For further details, please contact Grace O'Malley at email@example.com.