Weak Microvia Interface Open Forum at IPC APEX EXPO


Reading time ( words)

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface.

The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it. Attendees will be invited to share their own issues regarding the weak microvia interface and will learn how to participate on the subcommittee.

IPC Weak Microvia Interface Open Forum
Wednesday, January 30
10:15 AM to 12:00 PM
San Diego Convention Center
Room 11A

Preliminary Agenda

1. Background: History of the effort, scope of work, status and organization

2. Presentation: Current Understanding of the Problem/Mitigation Measures

3. Weak Microvia Interface Project Subteam Reports

• Data Collation and Mining on the Issue

• FMEA “Fishbone”

• Engineering Simulation

4. Next Steps and Goals

• Near term: Breakout teams

• Middle term:

o Knowns/Unknowns: Can any intermediate conclusions or improved mitigation techniques be communicated?

o Identify Testing Needed: Gaps and confirmation

• Long term: Prevention: Can it be accomplished through design, process enhancements, etc.?

5. Q&A Session and How to Get Involved

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed as a result of work done on IPC-WP-023. Order IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface from the IPC bookstore.

Share




Suggested Items

KIC Adds Wave Monitoring Technology to Industry 4.0 Ecosystem for Thermal Processes

04/13/2022 | Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.

Real Time with...IPC APEX EXPO 2021: Optimizing Pin Inspection In Automotive With True3D Tech

03/09/2021 | Real Time with...IPC
Guest Editor Michael Ford and Gustavo Jimenez, Koh Young's sales manager for Northern Mexico, discuss some of the company's newest technologies, including True3D™ technology for pin inspection, which has proven popular with the automotive segment.



Copyright © 2022 I-Connect007. All rights reserved.