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This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Last Call! Register Now for IPC APEX EXPO 2019
January 9, 2019 | IPCEstimated reading time: 1 minute
IPC APEX EXPO 2019, North America’s largest gathering of designers, board manufacturers, assembly companies, suppliers and original equipment manufacturers (OEMs), will take over San Diego soon!
And It's not too late for you to register if you haven't done so!
Which means, you still have time to benefit from the industry's most applicable educational program, highly productive in-person networking and the innovation that the IPC APEX EXPO's show floor delivers year after year.
Two Great Registration Options Deliver Your Best Value
1. Access the future with our All-Access Package (Save nearly 70% off à la carte options purchased separately.)
Our most comprehensive registration option, the IPC APEX EXPO 2019 All-Access Package gives you your most immersive experience and a great value. The package includes:
- All technical conference sessions
- Technical conference proceedings (provided online)
- Standards development committee meetings
- Environmental Policy Update
- Export Control Compliance: A Regulatory Update and Forecast
- Up to five half-day professional development courses
- IPC luncheons (Monday-Wednesday)
- Show floor concession cash on Thursday
- EMS Executive Management Meeting (must be a senior level executive of an EMS company to attend)
- Executive Forum on Automotive Electronics (must be a manager and above to attend)
- Event Essentials*
2. Opt for Full Conference Registration for outstanding education
Our Full Conference registration option connects you with the complete technical conference. Included are all technical conference paper sessions, conference proceedings (provided online), standards development committee meetings and Event Essentials (includes Exhibit Hall; Tuesday Show Floor Welcome Reception; Keynote Sessions; BUZZ Sessions; Poster Sessions; First-timers' Welcome Reception; Women in Electronics Reception; New Products Corridor; International Reception)
For pricing and additional registration options, click here.
Suggested Items
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.