Most Important Feedback


Reading time ( words)

In our recent I-Connect007 survey, we asked the following question: “What is the most important feedback that you receive after your board is manufactured?” Here are just a few of the replies, edited slightly for clarity.

Jim Pierce, Axiom Electronics: "Impedance specifications, testing results, and documentation."

Jon Ashton, Vergent Products: "Insufficient copper clearances (pours, trace/space, etc.); items missed during quote that affect price; and Gerber-format array files for approval including drill and route info."

Roger Hughes, Blackmagic Design: "Design issues that have reduced fabrication yield and assembly yield, and therefore increased cost; and feedback that identifies areas of specific improvement."

Share

Print


Suggested Items

Current Megatrends You Pay the Most Attention To

03/20/2019 | I-Connect007 Research Team
In our recent survey, we asked the following question: "What current megatrends do you pay the most attention to?" Below are some of the replies, edited slightly for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/14/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.



Copyright © 2019 I-Connect007. All rights reserved.