More Than Inspection: It’s Process Improvement


Reading time ( words)

Matties: As the industry moves forward and we see the integration of data, part of the problem that we're facing now is data overload. What sort of datasets do you think are the most valuable for people to look at?

D’Amico: There is a definite excess of data. It is important to understand, however, that only certain data may be useful from one machine to another. In other words, only specific subsets are going to be used by each machine. That's still something that we vendors are trying to determine what data can be used by each system to streamline the manufacturing process.

Let’s consider the following example in which we are assembling a panelized PCB with an X-out. The location of a bad module is not really useful to a screen printer, but it would be useful for to a solder jetting system. Once the bad module has been identified, this information is fed forward to the SPI system, the pick-and-place machine, the post-placement AOI systems, and the post-reflow AOI system, eliminating the need for these systems to check for X-outs and streamlining this particular process of identifying a bad module within a panel.

Matties: It's interesting because there are two parts to data. One is the data that the machine—upstream or downstream—needs, but there's also the data that the human needs because we have to put it into context. The context still matters such as what were the conditions, what caused the variations, and from the installs that you see, what sort of yield improvements are they getting with this 4.0 strategy?

D’Amico: Again, Industry 4.0 is still evolving within the electronics manufacturing industry. In my opinion, it will take some time for this project to mature. In the interim, the focus is on providing detailed process information to the manufacturing engineer so that they may use this data to maximize line efficiency and yield. For example, MIRTEC has developed a proprietary intelligent factory automation software suite called INTELLISYS. Within this suite is an application called Intelli-Track. This software collects data from our SPI, post-placement AOI, and post-reflow AOI machines, and provides this data to the process engineer on one dashboard. We also have a variant of this software called Smart-Loop where the application also displays data from an at-line X-ray system. Smart-Loop is a collaborative software application between MIRTEC and YXLON.

Matties: So, we are talking about human data.

D’Amico: Exactly. The process engineer can see all of this process data at a glance, allowing them to determine exactly where the defect was introduced within the manufacturing process. They would then use this data to modify the process as required. I consider this to be an interim Industry 4.0 solution because the machines aren't making these decisions. The goal is to maximize efficiency and decrease defects, and we still need a human to do that. As far as doing this automatically, our industry simply is not there yet.

Matties: Is it years down the road?

D’Amico: I believe so. This will require the collection and processing of bit data using AI. As an industry, we still have a way to go to achieve this goal.

Matties: As an equipment OEM, it sounds like you've focused on software code. Is that something you had to think about more recently in the last five years or so?

D’Amico: Yes, but rather than re-inventing the wheel, we made a strategic decision to partner with companies like Cogiscan. Cogiscan specializes in machine-to-machine communication, allowing us to connect to virtually any machine within the manufacturing line. Machine data is then collected, formatted, and entered into a repository from which it is made available to other systems within the line. This also overcomes the hurdle of working with some competitive systems. Together, MIRTEC and Cogiscan have collaborated on a fully integrated Industry 4.0 solution which is our total remote management system (TRMS). This application displays data collected from MIRTEC’s AOI and SPI systems as well as all other equipment in the SMT manufacturing line, giving our customers a clear view into the manufacturing process and helping them achieve higher operating efficiencies and improved quality.

Matties: The other thing that is interesting with manufacturing today is the datasets coming in from the factory at the design level to the bare board fabrication level because we hear that 99% of the files that come into a board shop need some form of data verification or correction. Do you see any issues with data coming into the EMS companies?

D’Amico: Definitely. On average, there is some sort of issue with the data 90% of the time, which is somewhat understandable because there are so many variables involved in the manufacture of finished PCB assemblies.

Matties: There has to be a discipline though. Someone is going to have to drive that data model.

D’Amico: I agree. It stands to reason if the data is inaccurate, then the process will ultimately fail. Industry 4.0 depends upon accurate data every step of the way. There is very little room for error.

Matties: It sounds like there's a real front-end need. When we talk about the factory automation part of it, people say, " I have a loader or unloader,” and that's factory mechanization. Automation is the ability to move data and have the equipment adjust and process without human intervention.

D’Amico: Yes; unfortunately, the proverbial lights-out factory is going to require a higher level of discipline every step of the way.

Matties: Do you have any final thoughts that you would like to share regarding Industry 4.0 and how it relates to SMT inspection?

D’Amico: I recently hosted a workshop at the Comet Group’s LabONE facility in San Jose, California, titled “The Future of SMT Inspection” where I pointed out that to truly attain Industry 4.0 and become lights out, at some point, feedback is going to be required after each stage of the manufacturing process. This translates to a requirement for more inspection equipment throughout the line. To achieve Industry 4.0 capability in the future, SMT manufacturers must invest in SPI equipment followed by post-placement AOI, post-reflow AOI, and X-ray inspection. This is a significant investment that must be understood moving forward.

Matties: And people used to look at inspection equipment as non-value added.

D’Amico: I know, but I believe that paradigm is changing.

Matties: We should start changing the term “inspection” to the phrase “process management.” You need inspection to get your process right, so it's a process management tool.

D’Amico: The absolute goal with any piece of inspection equipment is not only to catch defects but to provide the data necessary to perfect the manufacturing processes thereby preventing defects from ever occurring in the first place. Unfortunately, there are far too many variables in the manufacturing process to guarantee zero defects, which is why manufacturers must continue to rely upon automated inspection.

Matties: There are variations and climate, employee, and chemical changes. There are so many variables that you need the process management tools to keep it in line.

D’Amico: I agree entirely.

Matties: Thank you so much, Brian.

D’Amico: As always, it has been a pleasure, Barry!

Share

Print


Suggested Items

RTW IPC APEX EXPO 2019: Standards Updates: IPC-7093 & IPC-7530

03/13/2019 | Real Time with...IPC
Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization. Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also speaks about no-clean flux and its challenges.

Nate Ramanathan on Choosing a Prototype Partner and Production Supplier

03/12/2019 | Nolan Johnson, I-Connect007
AEye, a developer of perception systems for autonomous vehicles, has transitioned from initial engineering development into the final design for production and manufacturing of very large quantities. In an interview with I-Connect007, Nate Ramanathan, VP of operations at AEye, speaks about the criteria and his perspective on selecting vendors.

RTW IPC APEX EXPO 2019: MIRTEC Discusses Automation, CFX, and Sales Success

03/04/2019 | Real Time with...IPC
MIRTEC President Brian D'Amico speaks with I-Connect007 Guest Editor Dan Beaulieu about automation, the Connected Factory Exchange (CFX) standard, and their banner year last year. He speaks about Industry 4.0, automating the inspection process, and collecting more data to help refine the manufacturing process.



Copyright © 2019 I-Connect007. All rights reserved.