iNEMI Survey on New Package Technology Qualification Methodology

Reading time ( words)

The International Electronics Manufacturing Initiative (iNEMI) invites you to participate in a survey to help the electronics industry understand package qualification methodologies currently in use and how robust qualification plans are typically generated/developed.

This survey follows up on one conducted earlier this year by iNEMI’s New Packaging Technology Qualification Methodology project. It takes a closer look at the deficiencies and/or gaps in existing test methods and qualification standards identified in the previous survey, and focuses on more detailed information in a few key areas, specifically new package technologies and application spaces. The topics covered in this survey include:

  • Test methods
  • Qualification standards
  • New application use conditions
  • New application spaces
  • Package qualification methodology tools

Information from the two surveys will be used to recommend a methodology for the development and qualification of new packaging technologies and materials. The project will also report on current best practices for packaging qualification and address the gaps identified by the surveys.



Suggested Items

Meet Alfred Macha, SMT007 Columnist

11/06/2019 | I-Connect007 Editorial Team
Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.

Smart Manufacturing Roadmap: Data Flow Considerations for the Electronics Manufacturing Industry

07/02/2019 | Ranjan Chatterjee, Cimetrix Inc., and Dan Gamota, Jabil Inc.
The 2019 iNEMI Roadmap features a new chapter on smart manufacturing. The chapter identifies key technology gaps and needs and offers recommendations to guide the electronics manufacturing industry in realizing the benefits of smart manufacturing. This article is based on information excerpted from the chapter.

Digitalization: Key to the Future of Electronics Manufacturing?

06/28/2019 | Neil Sharp, JJS Manufacturing
Electronics manufacturers have long relied on automation to streamline their production processes. The concept of the smart factory takes this one step further with artificial intelligence (AI), robotics, analytics, big data, and the Internet of Things (IoT) promising an even greater level of autonomy, agility, and connectivity.

Copyright © 2020 I-Connect007. All rights reserved.