IPC Welcomes Brook Sandy-Smith as New Technical Education Program Manager


Reading time ( words)

IPC—Association Connecting Electronics Industries announces the addition of Brook Sandy-Smith as technical education program manager, to its staff at IPC headquarters in Bannockburn (Chicago), Illinois.

As manager of IPC’s technical educational program, Sandy-Smith will be responsible for content development and successful execution of IPC’s educational programs and technical proceedings for conferences, webinars, workshops, tutorials and professional development offerings for the electronics industry. She will lead the development and execution of the technical program and professional development curriculum components of the organization’s trade show events, specialty conferences and professional development events.

An experienced materials, process and applications engineer, Sandy-Smith has expertise in solving complex technical challenges, managing projects with multidisciplinary teams, and is an award-winning participant in electronics industry organizations, including three IPC distinguished committee service awards.

Prior to joining IPC, Sandy-Smith served as a senior technical support engineer and PCB assembly materials specialist at Indium Corporation, where she provided customer support of process and application development, was the preferred SMT expert for line audits and implementation of new designs and materials, and cultivated industry partnerships with equipment companies to understand new technologies in the industry. She also developed and standardized solder past test protocol and participated in training new engineers and engineering teams across the globe. An experienced presenter and author of many technical papers, Sandy-Smith won Indium Corporations’ best paper of 2016 and 2017. A graduate of the University of Rhode Island and Wilhemina Technical University in Braunschweig, Germany, Sandy-Smith is also an SMTA certified process engineer.

“We are thrilled to welcome Brook to IPC,” said Alicia Balonek, senior director, tradeshows and events. “With her extensive knowledge of the electronics manufacturing industry and IPC, she is a perfect fit as we work to create more relevant technical education programs for our membership.”

About IPC

IPC is a global industry association based in Bannockburn, Illinois, dedicated to the competitive excellence and financial success of its 4,900 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.



Copyright © 2019 I-Connect007. All rights reserved.