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In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.
Jon Ashton, Vergent Products: “The IPC/J-STD test methods are applied to all new pastes. This leads to all manufacturers saying that their material ‘meets the requirements’ but the rest of their pitch is all marketing. There needs to be a simple battery of tests, using a simple (cheap) PCB test vehicle, that can qualify a given paste in a specific process. This also applies to cleaning residues. Finally, the old pastes are still available. There is no reason to disturb an existing qualified process with a paste change. As such, they hang on forever to the long tail.”
Allen Bennink, VAL Engineering Sciences Inc.: "Usage of end product, and powder size and chemistry (of metal and flux carrier)."
Bob Rooks, Trak Microwave: “ROHS, age of components, and halogen-free RMA flux.”
Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”
Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.