Solder Paste Selection/Qualification


Reading time ( words)

In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

Jon Ashton, Vergent Products: “The IPC/J-STD test methods are applied to all new pastes. This leads to all manufacturers saying that their material ‘meets the requirements’ but the rest of their pitch is all marketing. There needs to be a simple battery of tests, using a simple (cheap) PCB test vehicle, that can qualify a given paste in a specific process. This also applies to cleaning residues. Finally, the old pastes are still available. There is no reason to disturb an existing qualified process with a paste change. As such, they hang on forever to the long tail.”

Allen Bennink, VAL Engineering Sciences Inc.: "Usage of end product, and powder size and chemistry (of metal and flux carrier)."

Bob Rooks, Trak Microwave: “ROHS, age of components, and halogen-free RMA flux.”

Share

Print


Suggested Items

A New Captive PCB Facility in the U.S.

04/19/2021 | I-Connect007 Editorial Team
Diane Maceri and Jessi Hall discuss how Schweitzer Engineering Laboratories (SEL) has been working with Alex Stepinski of GreenSource Fabrication to build their own captive PCB facility in Moscow, Idaho; the thought process behind that decision; and their involvement in the Managers Forum at IPC APEX EXPO 2021.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

04/15/2021 | Brent Fischthal, Koh Young America
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.

Emerging Engineers: Raviteja Boyana

04/01/2021 | Raviteja Boyana
Recent engineering graduate Raviteja Boyana discusses IPC's Emerging Engineer program and the IPC Education Foundation Scholarship, along with his mentorship with Gen3's Graham Naisbitt. Ravi has already found a job in the industry with Maxim Integrated.



Copyright © 2021 I-Connect007. All rights reserved.