Aqueous Founder Mike Konrad to Present at the SMTA Pan Pacific Microelectronics Symposium

Reading time ( words)

Mike Konrad will present “The Forgotten Benefits of Cleaning Circuit Assemblies for Harsh Environments” at the SMTA Pan Pacific Microelectronics Symposium February 11-14 at the Kauai Marriott Resort & Beach Club in Kauai, Hawaii. 

Mike’s presentation will cover the historical significance of residue-free circuit assemblies and the subsequent decline in accepted cleanliness standards. Contamination-related failure mechanisms will be discussed as well as considerations for determining a circuit assembly’s residue tolerance. Modern cleanliness assessment methods will also be discussed. 

The Pan Pacific Microelectronics Symposium features ground-breaking research from global experts on processing technologies, advanced process, advanced design, cleaning, harsh environments requirements, materials technology, trends in advanced packaging & interconnects, x-ray, inspection, and more. 

Mike Konrad is the founder of Aqueous Technologies and the host of the Reliability Matters podcast available on iTunes.



Suggested Items

Current Megatrends You Pay the Most Attention To

03/20/2019 | I-Connect007 Research Team
In our recent survey, we asked the following question: "What current megatrends do you pay the most attention to?" Below are some of the replies, edited slightly for clarity.

Rework and Reliability: Less is More!

09/15/2017 | Karen Tellefsen, Alpha Assembly Solutions
Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."

JJS Stresses Need for Baking Prior to Flex Circuit Assembly

04/20/2017 | Stephen Las Marias, I-Connect007
From an assembly perspective, baking the flex circuits prior to manufacturing assembly is crucial as they can be susceptible to delamination. In this interview, Russell Poppe, director of technology at JJS Manufacturing explains why, as well as discusses other challenges in flex circuit assembly and strategies to address them.

Copyright © 2019 I-Connect007. All rights reserved.