-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
PCB Manufacturing and PCB Depaneling Solutions from LPKF
January 18, 2019 | LPKF Laser & ElectronicsEstimated reading time: 1 minute
LPKF Laser & Electronics will be exhibiting at the IPC/APEX Expo in San Diego, California in booth 1651 this year, demonstrating its PCB depaneling and flex PCB drilling laser systems.
LPKF’s flex drilling systems are equipped for high through-put, high-yielding PCB drilling applications, allowing engineers to increase panel yield by an estimated 20% or even save on production steps. Common applications include drilling microvias, clean cutting of cover layer material, efficient and space-saving profiling, and blank cutting with cut edge quality. Engineers increase margins with the new generation of flexible laser machine for more efficient PCB processing. Additionally, laser technology achieves residue-free results that require no post-processing, saving the process step. Further, the number of modules per panel and the packing density can be increased, which reduces the manufacturing cost.
LPKF’s PCB depaneling systems are compact, developed for extremely clean and fast cutting PCB panels and cover layers. It reduces lead times and eliminates tooling costs of layout changes. The substrates are held securely on a vacuum table. This is ideal for depaneling, cutting and engraving a variety of substrates (cover layers, rigid, flex and rigid/flex).
In addition to these systems, LPKF will also be demonstrating its laser plastic welding systems and rapid PCB prototyping technology at the show. For more information on LPKF’s latest laser-based solutions, visit LPKF in booth 1651 at the IPC APEX EXPO 2019.
About LPKF
Established in 1976, LPKF Laser & Electronics manufactures milling and laser systems used in circuit board and microelectronics fabrication, medical technology, and the automotive sector. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides near Portland, Oregon.
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).