KIC to Launch New Smart Reflow Analyzer at IPC APEX EXPO 2019


Reading time ( words)

KIC plans to introduce the new SRA (Smart Reflow Analyzer) at IPC APEX EXPO 2019, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in California. The SRA is an integrated fixture and profiler specifically designed for collecting reflow oven related data to analyze and track machine stability from run to run, and over time. 

As it contains a built-in data collection module, it is an all-in-one smart fixture. This means that the SRA can be used no matter whose profiler you may currently have.

The SRA has six embedded thermocouples—three Air TCs and three Mass TCs—which are used to calculate and display a variety of data for each oven zone such as measured zone temperatures and side to side uniformity. With the use of the SRA, users also are able to identify changes in heat transfer in a zone over time, through the display of HTI (Heat Transfer Index). Additionally, it utilizes the latest in laser sensor technology to automatically measure the conveyor speed each time you run it through your machine.

The device is used to routinely check the performance of your machine and identify changes over time. Using a variety of available specifications, the machine’s performance is measured each time a pass is made based on your selected Process Window. The included SPC charting feature allows you to track the performance of individual zones, as well as other key parameters, based on specifications you select.

About KIC

KIC is a technology company working to make reflow ovens smarter through thermal profiling automation and optimization solutions. With offices across the globe, KIC is ready to become your partner in oven-based manufacturing. Corporate headquarters are located at 16120 W Bernardo Dr., San Diego, California 92127.  

Share

Print


Suggested Items

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Recent Advances in X-ray Technology: SMTA Webinar Recap

08/12/2019 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.

Cadence Design Systems Takes Tensilica to CES Show Floor

04/26/2019 | Nolan Johnson, I-Connect007
While roaming the aisles of CES, I happened across a suite hosted by Cadence Design Systems. It wasn’t a booth—just a quiet presence behind walls with demonstration hardware inside. Vic Markarian, senior group director for worldwide IP licensing and sales, explains why Cadence was at CES.



Copyright © 2019 I-Connect007. All rights reserved.