Nordson YESTECH to Demo Dual-Sided PTH AOI at IPC APEX EXPO


Reading time ( words)

Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, will feature the latest revision of the FX-942 dual sided automated optical inspection (AOI) system for solder and plated through-hole (PTH) applications at the IPC APEX EXPO 2019 in San Diego, California. During the exhibition, Nordson YESTECH will conduct live demonstrations in the booth of their complete line of AOI and conformal coat inspection (ACI) systems.

Nordson YESTECH’s FX-942 dual sided AOI system is ideally suited to inspect the unique challenges of plated through hole (PTH) assemblies, offering full defect coverage, inspecting solder joints and verifying correct assembly. The FX-942 ideally complements Nordson SELECT’s Selective Soldering systems providing inspection capabilities for demanding soldering applications.

The FX-942 saves valuable inspection time by providing high-speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts featuring:

  • Dual sided imaging with full travel imaging sensors
  • 1 vertical and 4 optional angle cameras per side
  •  Up to 100 mm clearance
  • High speed inspection and transfer
  • High defect coverage / low false failure
  • Picture in Picture (P-in-P) feature
  • MES / Industry 4.0 compatible

Programming the FX-942 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-942 utilizes a

standard package library to simplify training and ensure program portability across manufacturing lines.

 “We are excited to showcase our latest inspection solutions for 2019 at Apex,” said Don Miller, Nordson YESTECH general manager. “This is the ideal venue to meet with our valued customers and discuss our latest advancements in optical, X-ray and acoustic inspection technologies.”

About IPC APEX EXPO 2019

The electronics industry’s own event – a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need. For more information about IPC APEX EXPO 2019 and to register, visit http://www.goipcshows.org.

About Nordson YESTECH

Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly  and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces.  These products are supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries. 

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.