TRI to Participate in Smart Factory Live Production Line at IPC APEX EXPO 2019


Reading time ( words)

Test Research, Inc. (TRI) will participate in the Smart Factory live Production Line at IPC APEX EXPO 2019 held at San Diego Convention Center. The production line will feature both the HERMES standard (IPC-9852) and IPC’s Connected Factory eXchange (CFX) IoT messaging standard (IPC-2591), working seamlessly together to deliver the value of SMT automation.

Visit TRI’s demo site at booth #4426 with the exhibition of high-resolution 3D CT AXI TR7600F3D and evaluate TRI’s Smart Factory capabilities. Realize the Smart Factory with Zero False Calls and Zero Escapes with TRI’s world-class Test and Inspection Solutions.

Moreover, TRI is celebrating its 30th anniversary as the leading test and inspection solutions provider for the electronics manufacturing industry. Join us at IPC APEX EXPO 2019 in booth #2533 on January 29-January 31, 2019, to learn more about the latest innovations in 3D SPI, 3D AOI, 3D CT AXI, and multicore ICT.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.

Share

Print


Suggested Items

Tips & Tricks: Water Contamination and Flux Expiry

04/17/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions
Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.

Tips & Tricks: Humidity Level for Electronics Assembly

04/10/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions
Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.

IPC Working to Revive Lead-Free R&D in High-Reliability Sectors

04/10/2019 | Chris Mitchell, IPC VP, Global Government Relations
Ask yourself the following question: Why is it that the aerospace, defense and high performance (ADHP) electronics sectors remain reliant on lead solders and components even as the commercial sector has largely phased out their use?



Copyright © 2019 I-Connect007. All rights reserved.