SMTA Posts Electronics in Harsh Environments Conference Program


Reading time ( words)

SMTA Europe is proud to announce the 2019 Electronics in Harsh Environments Conference, April 2-4 in Amsterdam, Netherlands. This global conference is a three day technical event focused on building reliable electronics used in power electronics and harsh environments.

The Electronics in Harsh Environments conference draws attendees, speakers and exhibitors from around the world. Attendee demographics range across Asia, Europe, UK and the United States. This year’s technical conference will feature speakers from the industry’s most respected companies such as Collins Aerospace, Fiat Chrysler Automobiles, Fraunhofer, Henkel, McLaren Automotive, Robert Bosch GmbH and more.

This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards are presented.

About SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

Award-winning Koh Young Process Optimizer

02/18/2019 | Dan Beaulieu
Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.

Benefits of Jet Printing Solder Pastes

01/30/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

01/30/2019 | Real Time with...IPC
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.



Copyright © 2019 I-Connect007. All rights reserved.