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In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.
Erik Widding, Birger Engineering Inc.: "No stencils and immediate ability to vary paste volumes anywhere on the PCB. Also, very little wasted material, as none is exposed to the environment until after dispense."
Jason Nipper, UTC: "Ability to selectively print without Kapton taping apertures on stencil. No need for stencil, good for test and NPI development."
Stephan Kohler, Turck: "Rapid prototyping."
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This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)
07/24/2019 |
Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)
07/16/2019 |
Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.
