Benefits of Jet Printing Solder Pastes

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In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

Erik Widding, Birger Engineering Inc.: "No stencils and immediate ability to vary paste volumes anywhere on the PCB. Also, very little wasted material, as none is exposed to the environment until after dispense."

Jason Nipper, UTC: "Ability to selectively print without Kapton taping apertures on stencil. No need for stencil, good for test and NPI development."

Stephan Kohler, Turck: "Rapid prototyping."

10/14/2019 | Real Time with...SMTAI

Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

10/09/2019 | Real Time with...SMTAI

The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

10/03/2019 | Happy Holden, I-Connect007

Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.