Benefits of Jet Printing Solder Pastes

Reading time ( words)

In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

Erik Widding, Birger Engineering Inc.: "No stencils and immediate ability to vary paste volumes anywhere on the PCB. Also, very little wasted material, as none is exposed to the environment until after dispense."

Jason Nipper, UTC: "Ability to selectively print without Kapton taping apertures on stencil. No need for stencil, good for test and NPI development."

Stephan Kohler, Turck: "Rapid prototyping."

04/10/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions

Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.

04/03/2019 | Tim Haag and Barry Matties, I-Connect007

At PCB West in Santa Clara, California, Dr. Bill Cardoso of Creative Electron held a class on advanced packaging and X-ray inspection strategy. Guest Editor Tim Haag and Publisher Barry Matties met with Bill to further discuss his class and the importance of turning inspection data into information.

03/27/2019 | Nolan Johnson, I-Connect007

At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?