Benefits of Jet Printing Solder Pastes

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In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

Erik Widding, Birger Engineering Inc.: "No stencils and immediate ability to vary paste volumes anywhere on the PCB. Also, very little wasted material, as none is exposed to the environment until after dispense."

Jason Nipper, UTC: "Ability to selectively print without Kapton taping apertures on stencil. No need for stencil, good for test and NPI development."

Stephan Kohler, Turck: "Rapid prototyping."

06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America

Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

05/08/2019 | Greg Smith, BlueRing Stencils

In the first part of this two-part article, Greg Smith talks about a study wherein a test vehicle was created to show transfer efficiency over a wide array of area ratios. Part 2 discusses the results of the experiment, including discussions of the different SEM results featuring the paste transfer efficiencies of each material, to better understand how the aperture wall surface smoothness compares to SMT stencil performance.

04/24/2019 | Greg Smith, BlueRing Stencils

As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products.