Leo Lambert Inducted into IPC Hall of Fame


Reading time ( words)

Leo Lambert, vice president and technical director at EPTAC Corporation has been given the highest IPC Honor, The Raymond E. Prichard Hall of Fame Award for his extraordinary contributions to the electronics industry and the IPC. Leo received this award and induction during the IPC APEX EXPO 2019 in San Diego during which Leo’s longstanding achievements were spotlighted.

Leo Lambert has been the vice president and technical director at EPTAC Corporation for over two decades, but a consummate contributor to the electronics industry and the IPC for much longer than that. His involvement with the IPC stems back to 1976, where Leo first engaged the committee’s efforts was under Harris Electronics and later in his career, Digital Equipment Corporation, known as DEC for many years prior to EPTAC.

Through these efforts, Leo has been an engaged contributor, chair and co-chair of numerous committees and task groups through-out the years and continues to serve in these rolls to this day. As a participant in the Technical Activities Executive Committee (TAEC) and active contributor to IPC J-STD-001 and Handbook, IPC-A-610 and IPC-AJ-820 Handbooks, IPC-A-600, IPC-6012 and IPC/WHMA-A-620, Leo has continued to support industry efforts to develop best practices and advocate excellence in electronics manufacturing.

Leo continues to be a champion, supporter and yes, sometimes zealot for the promotion of the industries adoption of standards and their development to date. In addition, his efforts spilled over into the certification process, supporting these programs and nurturing them to where they are today.

“Leo’s accomplishments and awards are too numerous to mention in a release, but they only scratch the surface of the man we at EPTAC know”, comments Mark Pilkington, President and CEO of EPTAC Corporation. “It is an honor to work with someone with endless patience, a willingness to educate and guide everyone he comes into contact with and a selfless unjudging commitment to support not only everyone at EPTAC, but our client base as well. On a personal note, we are proud of his achievements, humbled to call him a friend and honored to play a small part of his journey for decades, whereas many have only experienced his presence briefly.”

EPTAC, the most internationally recognized leader in solder training and IPC certification, gives professionals the skills to accelerate their careers and businesses the talent to succeed in this ever-competitive industry. For over 30 years, EPTAC has been helping companies increase quality standards, improve productivity and maximize profits. Headquartered in Manchester, NH, EPTAC delivers the industry best training programs throughout established locations in the United States and Canada.

Share

Print


Suggested Items

Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 1)

04/24/2019 | Greg Smith, BlueRing Stencils
As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products. The primary inputs in the SMT stencil manufacturing process are material, equipment, and processes, and by continuously improving these inputs, the overall print process is improved. The most important material in the process of manufacturing SMT stencils is the foil itself. This article investigates foil types used with the goal of determining which foils provide the best print performance.

Tips & Tricks: Water Contamination and Flux Expiry

04/17/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions
Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.

Tips & Tricks: Humidity Level for Electronics Assembly

04/10/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions
Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.



Copyright © 2019 I-Connect007. All rights reserved.