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ASM CEO Americas Jeffery L. Timms and Technica President and CEO Frank Medina give I-Connect007 Managing Editor Nolan Johnson a product update on ASM's mid-speed machines—EbySIPLACE and EbyDEK.
The new mid-level models of ASM's machines are gaining attention, Timms and Medina discuss the how and why.
To watch the interview, click here.
I-Connect007 Editorial Team
Thanks to marketing and advances in technology, we have all come to expect that the electronic products we buy will be closely aligned to our individual and specific lifestyle or business requirements. This expected variability, in personal function and style, as well as regulatory compliance and a changing global economic landscape, has made designing and producing new products a challenging prospect. And, on top of the resulting “high-mix, low-volume” production cycles, increasingly more products contain electronic components in varying levels that heighten the complexity of design and manufacturing.
Nolan Johnson, I-Connect007
At SMTA International 2021, Nolan Johnson spoke with Rob DiMatteo of BTU International about the current shift in market drivers, pain points from customers, and what he expects to see in the near future. Chip shortages and port delays are just two of the challenges facing BTU’s customers. As general manager of BTU, DiMatteo wants his company to excel at customer service despite these challenges. He also previews a new flux management technology for keeping reflow ovens extremely clean, calling it a significant breakthrough.
William Webb, ASTER Technologies
Achieving design for test (DFT) can be challenging for both design and test groups, as sometimes both expect that the other will be the one to manage DFT. The design and test groups might be in the same organization, or they could be an OEM vs. an EMS company. It works best if both the design and test groups are engaged in the process of DFT and trying to achieve the goal of the best test coverage and lowest rate of field returns.