ZESTRON Academy Releases 2019 Cleaning Webinar Schedule


Reading time ( words)

ZESTRON Academy has released the 2019 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.

All webinars are FREE of charge, and will be presented by ZESTRON Academy’s accredited experts, Umut Tosun, M.S.Ch.E., Application Technology Manager, and Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer.

Featured topics:

  • Should You Clean PCBs (March 21)
  • DI-Water vs Chemistry (April 25)
  • Cleaning with pH Neutral Chemistry – Background, Applications, and Benefits (May 23)
  • Jet Printing Solder Paste and Cleaning Challenges (June 27)
  • Defluxing Advanced Packages (July 25)
  • Surface Cleanliness Assessment (August 29)
  • Cleaning Before Conformal Coating (September 26)
  • Multiple Thermal Cycle (October 24)

About ZESTRON

ZESTRON is headquartered in Manassas, Virginia and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

Share

Print


Suggested Items

Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 1)

04/24/2019 | Greg Smith, BlueRing Stencils
As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products. The primary inputs in the SMT stencil manufacturing process are material, equipment, and processes, and by continuously improving these inputs, the overall print process is improved. The most important material in the process of manufacturing SMT stencils is the foil itself. This article investigates foil types used with the goal of determining which foils provide the best print performance.

Tips & Tricks: Water Contamination and Flux Expiry

04/17/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions
Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.

Tips & Tricks: Humidity Level for Electronics Assembly

04/10/2019 | Jason Fullerton, MacDermid Alpha Electronics Solutions
Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.



Copyright © 2019 I-Connect007. All rights reserved.