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Indium Corporation’s Tim Jensen, product manager for engineered solder materials, will present at the Semi-Therm 35th Annual Symposium & Exhibit, March 18-22, in San Jose, California, USA.
Jensen’s presentation entitled Innovative Liquid Metal Thermal Interface Technology for TIM2 Applications will examine the methodologies and techniques that can enable liquid metal to be used in a higher array of TIM1, TIM1.5, and TIM2 applications. Jensen will also address the processing challenges of using a liquid metal.
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.