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TopLine will exhibit its innovative CCGA solutions at the upcoming Electronica China and Semicon China (co-located) March 20-22, 2019, at the Shanghai New International Expo Center. TopLine is a world-leading manufacturer and designer of component solutions and test vehicles for SMT/PCB assembly.
Featured products will include CCGA - Column Grid Arrays and daisy chain BGA test vehicles. ”There is growing Interest in CCGA Column Grid Array packages in China,” states Martin Hart, TopLine’s CEO. “It's about reliability. PCBA manufacturers are selecting CCGA packages because of the CCGA's ability to reduce stress directly caused by CTE mismatch.”
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible high-temperature solder columns for Surface Mount (SMT) soldering on Printed Circuit Boards (PCBs). CCGA packages provide more compliancy than BGA solder balls (Ball Grid Arrays) to absorb stress caused by CTE mismatch and increase solder joint reliability under harsh operating conditions.
TopLine has been active in promoting its products in the China market for more than 20 years.
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.