ULT Launches New Generation of Mobile Fume Extraction Units


Reading time ( words)

ULT AG has launched its next generation of portable fume extraction units for small and medium air pollutant quantities. The ULT 160.1 features a new, visually appealing design and improved device handling, has high filtration rates, extremely low-noise operation, and an optimized price-performance-ratio.

ULT provides the systems as specific versions for the removal of laser fume (type LAS 160.1), soldering fume (LRA 160.1), dusts (ASD 160.1), or gases, odors and vapors (ACD 160.1). Specifically configured filter technologies are utilized for the respective applications. The ULT 160.1 units can be connected to external systems via a D-Sub interface for automated operations, for instance, laser marking systems, soldering machines, or dispensing devices.

ULT's fume extraction systems help to eliminate airborne pollutants released during joining, separation or surface processing technologies. The units remove the finest of particles and emissions in automated and semi-automated production processes as well as manual workplaces in many industries.

About ULT AG

Founded in 1994, ULT AG is a leading vendor of high efficiency fume extraction technology and process air drying solutions. The broad range of equipment has been designed for use in various industries, covering a wide range of applications. Among the solutions offered, there are standard products as well as custom-built units for special applications. ULT AG provides customers all over the world with fume extraction systems for material processing as well as onsite services. The company has been DIN EN ISO 9001 certified for more than 20 years.

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.

Minimizing Voids in Solder Joints

06/07/2019 | Rehm Thermal Systems
Dr. Hans Bell of Rehm Thermal Systems, Henryk Maschotta of Thales Deutschland GmbH, and Dr. Heinz Wohlrabe of TU Dresden presented the results of their project on reducing void content in the solder joints of land grid arrays (LGAs) at a soldering seminar during the Technology Days of the recent SMTconnect show in Nuremberg.



Copyright © 2019 I-Connect007. All rights reserved.