RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering


Reading time ( words)

In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.

Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

Share

Print


Suggested Items

Industry Outlook from IPC's Sharon Starr

03/18/2019 | Patty Goldman, I-Connect007
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.

Two Full CFX Demo Lines at IPC APEX EXPO 2019

03/05/2019 | Dan Feinberg, Technology Editor, I-Connect007
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.

RTW IPC APEX EXPO 2019: Advanced 3D Solder Paste Inspection Technology

02/27/2019 | Real Time with...IPC
Olivier Pirou, managing director of Vi TECHNOLOGY, provides Joe Fjelstad with an overview of the company's advanced 3D solder paste inspection technology, featuring the ability to make corrections in real time. Pirou also talks about their efforts in strengthening their inspection systems.



Copyright © 2019 I-Connect007. All rights reserved.