RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

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In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.

Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

06/19/2020 | I-Connect007 Editorial Team

The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

06/17/2020 | Nolan Johnson, I-Connect007

The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

06/10/2020 | I-Connect007 Editorial Team

The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.