RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

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In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.

Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

03/05/2021 | I-Connect007

As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors share their knowledge and expertise in the following categories.

03/03/2021 | Nolan Johnson, I-Connect007

Nolan Johnson recently spoke with Tuan Tran, director of customer solutions at Green Circuits, about what makes a successful process engineer. They also discuss a typical day in the life of a process engineer—from pre-manufacturing through post-DFM, for process improvement. As Tuan points out, there are a variety of paths to becoming a great process engineer.

03/03/2021 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Super Dry’s Richard Heimsch about how the need for dry storage solutions has increased throughout the pandemic, including further demands for traceability and automation capabilities.