Reading time ( words)
In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.
Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.
Share
Suggested Items
I-Connect007 Releases Episode 2 in the Micro Webinar Series: ‘Smarter Manufacturing Enabled with Inspection Data’
03/15/2023 |
I-Connect007
Episode 2, “Understanding CFX and Hermes” from Koh Young’s new micro webinar series ‘Smarter Manufacturing Enabled with Inspection Data’ is available now.
Christina Trussell: The Sky’s the Limit
03/14/2023 |
Patty Goldman, I-Connect007
Christina Trussell is a harness design engineer at Blue Origin and a recipient of the IPC Rising Star Award. Since she was a young child, she wanted to fly through the skies. In this interview, she talks about her dreams and what it’s like to work in the electronics industry.
A First Look at IPC-CFX Box for Legacy Equipment
02/28/2023 |
Chris Jorgensen, IPC
Although the prevalence of IPC-CFX in the electronics manufacturing industry has increased since the standard’s launch in spring 2019, the committee responsible for the standard has recognized legacy equipment in the field as a significant barrier to widespread industry adoption. To address this, an A-Team under the IPC-CFX Standard Task Group spent the past year working on a project that provides simple, readily available IPC-CFX hardware with supporting SDK that can act as an IPC-CFX endpoint for existing legacy equipment.
