RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

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In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.

Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

03/25/2020 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Matt Stevenson, VP of marketing at Sunstone Circuits, who shares an update on the company's current level of business operations under COVID-19 restrictions. Stevenson confirms that Sunstone Circuits is fully operational and classified as an essential business.

03/09/2020 | Real Time with...IPC

In this video interview from the show, Guest Editor Steve Williams talks with Oren Manor—director of business development at Mentor, a Siemens Business—about Industry 4.0, robotics, and other applications. They also addressed integration of Mentor's CAD/CAM solutions with Siemens' mechanical offerings.

03/04/2020 | Real Time with...IPC

In this video interview from the show, Guest Editor Dan Beaulieu and Michael Ford, senior director of emerging industry strategy at Aegis Software, discuss the IPC-CFX standard that allows machines to communicate with other machines. They also focus on some strategies that can turn any factory with old or new equipment into a smart factory.