RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

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In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.

Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

10/27/2019 | Andy Shaughnessy, I-Connect007

At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.

10/14/2019 | Real Time with...SMTAI

Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

10/09/2019 | Real Time with...SMTAI

The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!