RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

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In this interview, Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical.

Chris explains the challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

05/01/2019 | Barry Matties, I-Connect007

Ralf Wagenfuehr, plant manager of Rehm Thermal Systems, describes Rehm's new oven—the RDS Semico—and gives an in-depth analysis about how it was designed specifically with the semiconductor industry in mind. Ralf also discusses the semiconductor industry as a whole and outlines the company’s desire to gain market share in Taiwan and Korea in the upcoming year.

04/12/2019 | Real Time with...IPC

IPC VP of Global Government Relations Chris Mitchell discusses with Judy Warner the association’s initiatives such as the IPC Workforce Champions, the skills gap analysis, and how IPC plans to advocate for the industry and grow the supply chain in North America and around the world.

04/01/2019 | I-Connect007

Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.