-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
YINCAE Advanced Materials to Exhibit at IMAPS New England Symposium
March 13, 2019 | YINCAE Advanced MaterialsEstimated reading time: 1 minute
YINCAE Advanced Materials will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, Massachusetts. Additionally, Dr. Wusheng Yin, president of YINCAE, will be giving a presentation on our unique product, zero outgassing and flux residue-compatible underfill.
One of the most essential and difficult aspects of wafer level integration is the requirement for zero outgassing during the underfill curing process. This step is crucial as outgassing can contaminate neighboring components. Additionally, cleaning flux residue is also becoming more difficult as electrical components across all industries are increasing in density and miniaturization. In particular, the automotive industry is growing rapidly in its need for underfills as they can be used to enhance mechanic strength and to absorb stress from CTE mismatch.
In response to this growing need, YINCAE has successfully developed a zero outgassing, flux residue-compatible underfill, the SMT 158HA. This underfill does not require the cleaning of flux residue and has repeatedly demonstrated zero outgassing during the curing process. After curing, the electronic device can pass a 5x 260°C reflow process.
About YINCAE Advanced Materials
Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
Suggested Items
Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
04/12/2024 | Newccess IndustrialOn a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry.
The Need for a Holistic Global Sustainability Standard
04/10/2024 | Michael Ford, Aegis SoftwareNo one can deny that the resources of our fragile planet are finite. The environment seems like a third party, subject to constant degradation. We’re acutely aware of the effects of pollution on our climate, and despite our “throw-away” culture, recycling and recovery of materials has remained relatively expensive, even as we use more energy just to survive.
iNEMI Publishes Four Roadmap Topics
04/04/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Checking In With ICAPE Group
04/03/2024 | Nolan Johnson, I-Connect007ICAPE Group’s field application engineer Erik Pederson drills down on sustainability, supply chain resiliency, and what value engineering really looks like in this exclusive interview. Founded in 1999, European-based ICAPE Group provides 21 million printed circuit boards and over six million technical parts to manufacturers every month. With 30 PCB manufacturing partners globally and 50 partners providing a wide array of technical parts, ICAPE Group has operations in China, Taiwan, Thailand, South Korea, Vietnam, South Africa, Europe, Mexico, and the United States. The company also focuses on the value proposition for its customers.