Indium Launches New Hybrid Metal Thermal Interface Materials


Reading time ( words)

Indium Corporation has released m2TIMTM — a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.

Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.

Other m2TIMTM benefits include:

  • Availability in a variety of alloys, including InGa and InGaSn
  • Extraordinary wetting ability to both metallic and non-metallic surfaces
  • Extremely low interfacial resistance at surfaces
  • Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com.

Share

Print


Suggested Items

UV-curable Materials and Conformal Coatings

12/23/2019 | Pete Starkey, I-Connect007
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

Meet Chris Ellis, SMT007 Columnist

09/18/2019 | I-Connect007
Meet Chris Ellis, one of our newest SMT007 columnists! In his columns, Ellis addresses common problems that Manncorp customers have had with the in-house conversion process, and shares solutions that have worked in the past.



Copyright © 2020 I-Connect007. All rights reserved.