MacDermid Alpha’s Julien Joguet to Present on High-Rel Sintered Materials at SIA Multi-Material Congress


Reading time ( words)

MacDermid Alpha Electronics Solutions is participating in the SIA Multi-Material Congress to be held on the 20 & 21 of March at the ESTACA engineers school near Paris.

The conference objective is to understand the impact of batteries integration on electric vehicles architecture and present innovative product and process solutions to address current expectations involving lightweight management, battery operating life and the reduction of CO₂ emissions. Julien Joguet, Global Business Market Manager for MacDermid Alpha will be presenting on enhancing considerable weight improvement and better overall efficiency for HEV and EV’s.

“It has been demonstrated that by replacing the conventional die attach materials used in the traction inverter with sintered silver, power cycling capability is improved by an order of magnitude while the current density per integrated circuit device can be increased by at least 50%,“ said Julien Joguet. “This has led to significantly smaller, lighter and more reliable systems, enabling a competitive advantage for the adopters of sinter silver technology.”

By moving to sintered silver and adopting any necessary changes needed in the manufacturing process, the opportunity exists to realize significant performance and reliability gains. ALPHA Argomax sintered silver has been successfully deployed in large volume EV automotive inverter applications and has achieved high performance, endurance power cycling capability, improved power density and superior electrical and thermal performance. 

About SIA

Since 1927, the French Society of Automotive Engineers (SIA) brings together all the specialists and enthusiasts of the automotive industry and its technologies: Car and Component Manufacturers, Engineering consultancies, Start-ups, SME-SMI, Precompetitive R&D clusters, Universities and Research Centres. Typical of any learned society, the SIA's goal is to encourage the development and knowledge sharing by engineers, managers and technicians of French or French-based companies and major groups in the automotive sector and mobility of the future.

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com

Share

Print


Suggested Items

SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role

10/02/2019 | Real Time with...SMTAI
Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions (and co-organizer for the upcoming SMTA Additive Electronics Conference), and Nolan Johnson discuss her new role, recent company reorganization, and the synergies customers are seeing.

3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0

06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

Smart Factory Transitions Are Attainable—With a Plan

06/04/2019 | Nolan Johnson, I-Connect007
In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.



Copyright © 2020 I-Connect007. All rights reserved.