What Do You Know About Automation?


Reading time ( words)

Test what you know in this 10-question automation quiz! Hint: It helps to download and read I-Connect007’s free eBook Automation and Advanced Procedures in PCB Fabrication at i007ebooks.com/automation.

Questions

1. What was the first plug-and-play equipment protocol?

a. TCP/IP

b. RS-232

c. IEEE-488.2 (HP-IB and GPIB)

d. IEEE-288 (HP-IL)

e. Ethernet

2. What was the first wireless plug-and-play equipment protocol?

a. IEEE-802.3

b. RS-232/RS-423

c. IEEE-488 (HP-IB)

d. HP-Ir

3. What is considered the first widely accepted automation protocol?

a. GM’s MAP

b. RS-232

c. SEMI SECSII/GEM

d. IPC-2581

4. What automation protocol was used in the world’s first “lights-out factories”?

a. General Motors’s MAP

b. SEMI SECSII/GEM

c. IEEE-802.3

d. IEEE 802.11 Wi-Fi

5. What is the definition of automation?

a. More mechanization

b. Digitization of the factory

c. A vector made up of the stages of mechanization and the level of systemization (information)

d. The use of computers

6. How is ROI calculated?

a. Profits divided by investments

b. The time it takes for profits to recover the investment

c. The equivalent interest rate the cash flows produced over the useful life of the project

d. The net present value of all of the investments cash flows

7. How can you categorize the stages of mechanization?

a. Add conveyors

b. No people needed

c. Automatic loading and unloading

d. Measure the percent of machine time for the total time of activities at a work center

8. By the same token, how can you categorize the levels of systemization (information)?

a. Add computers

b. No people needed

c. Measure the percent of human information time for the total time of all information at a work center

d. Buy more software

9. What is the Connected Factory Exchange (CFX)?

a. Assembly equipment

b. Assembly software

c. An open standard electronic assembly protocol created by an IPC Committee

d. A new vendor for electronics assembly equipment

10. Which one below is NOT a basic sensor?

a. Wet chemistry

b. Nuclear

c. Temperature

d. Volume/count

e. Electrochemical

f. Specific gravity

g. Colorimetric

To find out the answers to this quiz, which appeared in the March 2019 issue of SMT007 Magazine, click here.

Share




Suggested Items

The ‘Intel’ on Advanced Packaging Options

11/29/2022 | Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?

Brian O'Leary: Organizing to Meet e-Mobility in the Market

11/28/2022 | Real Time with...SMTAI
Brian O’Leary, head of Indium's e-Mobility & Infrastructure, reacts to SMTAI’s keynote delivered by John Thomas of Autel. The title of the keynote presentation was "The Electronic Vehicle (EV) Conundrum" which addressed the sheer scale of the transition to e-Mobility that we are now undertaking. In this interview, O’Leary discusses some of the technical challenges faced in product development by Indium (and everyone else) as well as the new IPC e-Mobility council. Participation in the council is open to everyone.

Advanced Packaging Symposium: Looking in the Rearview Mirror

11/23/2022 | Nolan Johnson, I-Connect007
Matt Kelly had the vision and Jan Vardaman set the tone for the IPC Advanced Packaging Symposium, Oct. 11-13 in Washington, D.C. So, did they accomplish their goals? What were the real takeaways from the event, and what can we expect to see next? Spoiler alert: Matt and Jan came away impressed in more ways than one.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.