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IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.
This course is ideally suited for process engineers, quality managers, auditors and others defining contractual requirements for soldering and acceptance.
Attendees will learn:
- How these documents complement each other and where they differ;
- How to provide clear instructions on drawings and documentation;
- What takes precedence when a conflict occurs in the requirements;
- How to navigate the complex world of ensuring staff training and proficiency requirements can be met.
- What is needed to properly flow down requirements to suppliers and the pitfalls of taking shortcuts.
“J-STD-001 and IPC-A-610 are written and revised in synergy,” said Teresa Rowe, senior director, assembly and standards technology, “so it makes sense to use them together. This course is designed to teach attendees how to use these standards jointly.”
Courses will be offered in the following locations:
- April 2, 2019, King of Prussia, Pennsylania (full-day course)
- May 5-6, 2019, Nuremberg, Germany (full-day course delivered over two half days)
- September 10, 2019, Huntsville, Alabama (full-day course)
- December 3, 2019, Anaheim, California (full-day course)
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.