CyberOptics Brings 3D Sensing Technology to NEPCON China


Reading time ( words)

CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at NEPCON China, scheduled to take place April 24-26, 2019 at the Shanghai World Expo Exhibition and Convention Center. The company will demonstrate the MRS-Enabled 3D SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications in Booth # 1E52 and 1E54.

The SQ3000, deemed best-in-class, has been widely used for 3D Automated Optical Inspection (AOI) and can be used for 3D solder paste inspection (SPI) for the best accuracy, repeatability and reproducibility—even on the smallest paste deposits.

Additionally, the SQ3000 can be used to attain highly accurate coordinate measurements faster than a traditional Coordinate Measurement Machine (CMM)—in seconds, not hours. The world’s first in-line CMM includes a comprehensive software suite for use in industrial metrology, semiconductor, microelectronics and SMT applications.

“Customers worldwide have been rapidly adopting the SQ3000 and recognizing it as the premier process control solution, particularly for the most challenging applications,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “The MRS-enabled multi-function system can identify critical defects and measure critical parameters, in order to fix what can be found and control what can be measured. Ultimately, we’re enabling significant improvements in yields, quality and operational efficiencies in their manufacturing facilities.”

The SQ3000 offers a combination of unmatched accuracy and speed with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the proprietary MRS technology an ideal solution for a wide range of applications with exacting requirements. 

About CyberOptics

CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Share




Suggested Items

Passing the Test With SMTA’s Rob Boguski

09/14/2022 | Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.

Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation

09/14/2022 | Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.



Copyright © 2022 I-Connect007. All rights reserved.