Huawei Chooses Universal to Automate Complex Server Assembly

Reading time ( words)

Huawei Technologies Co. has chosen Universal Instruments’ FuzionOF platform to automate complex component placement in its server board applications. They have begun scaling FuzionOF in production, replacing manual assembly processes and realizing substantial output gains.

With integrated solutions across four key domains—telecom networks, IT, smart devices, and cloud servicesHuawei Technologies is committed to bringing digital to every person, home and organization for a fully connected, intelligent world. Huawei manufactures intelligent servers that are flexible, balanced, efficient, and feature a modular design for cloud computing virtualization, database, high-performance computing, mission-critical applications, and more workloads.

Huawei selected FuzionOF based on the platform’s inherent speed, repeatability and ability to handle a broad range of components on a single platform, maximizing automation ROI. The new platforms form the foundation of Huawei’s Golden Server production line. They are automating insertion of 16 unique pin-in-paste odd-form components, including VGAs, RJ45s, SATA and PCIE connectors, pin headers, electrolytic capacitors (e-caps), and more. The FuzionOF solution also includes bowl, radial, tray, and track feeder integration.

By transitioning to the high-speed, high-accuracy FuzionOF solution, Huawei has seen significant improvements. Daily printed circuit board (PCB) output has more than tripled, while the first-pass yield rate has been more than 99.5% and downtime less than 1%.

FuzionOF boasts several advantages for end-of-line odd-form applications by offering full inspection, consistent placement forces, and having the flexibility to easily transition to new products and requirements. These advantages provide the agility, versatility, yield, and performance to excel in both higher-mix and higher-volume environments.

“We’re thrilled to work together with a world-class partner like Huawei,” said Universal Instruments Vice President of Customer Operations, Brad Bennett. “Automation continues to drive the electronics assembly landscape and we’ve developed our portfolio to meet this challenge head-on. More importantly, we’re positioned to help our customers embrace automation and fortify their leadership positions.” Bennett continued, “FuzionOF will be a tremendous asset for Huawei and we hope it will serve as a cornerstone to continue and expand our cooperation.”



Suggested Items

IPC APEX EXPO 2020 Attendees Speak: Joel Scutchfield

02/19/2020 | Kelly Dack, CID+, EPTAC
"Based on traffic and attendance, we have had a great week. We had 40+ more scans than what we did last year at this point, and we’re waiting for the final tally today," said Joel Scutchfield, Koh Young's director of sales for the Americas.

How Digitalization Is Transforming the Electronics Manufacturing Industry

09/11/2019 | Neil Sharp, JJS Manufacturing
The rise of the "digital" supply network—such as the cloud, big data, 3D printing, augmented reality, or the internet of things (IoT)—promises to address issues such as increasing global competition, rising consumer expectations, and the increasingly complex patterns of consumer demand, by providing a greater level of transparency, innovation, and resiliency. And there is a growing belief among business strategists that the more digitalized our manufacturing supply chains can become, the greater our efficiency will be.

The Exciting Details Behind IPC’s Pledge to America’s Workers

08/07/2019 | Chris Mitchell, IPC VP, Global Government Relations
In the nine months since IPC joined in President Trump’s “Pledge to America’s Workers” and committed to creating 1 million new skilled workforce opportunities over the next five years – a fair question has been asked: Are we taking credit for actions we would have done anyway? Was this motivated by politics?

Copyright © 2020 I-Connect007. All rights reserved.