KIC Service Manager to Present “Profiling the Wave Solder Process”


Reading time ( words)

KIC announced that it will participate in the SEHO Technology Days, scheduled to take place May 7-8, 2019 at the SEHO North America, Inc. Technology Center in Erlanger, Kentucky. KIC Service Manager Robert Baxter will present “Profiling the Wave Solder Process.”

This presentation will discuss the need for profiling the wave process and showcase various types of wave solder profiling configurations. Analyzing profiling results and optimizing wave profiling as well as continuous wave process monitoring also will be covered during the presentation.

Baxter has been with KIC for 22 years. He has been in the electronics industry for nearly 30 years, both in Europe and the US. Baxter has extensive experience in both reflow and wave soldering.

The SEHO Technology Days are based on a simple principle: To provide a perfect balance of theory and practical application. Discuss your manufacturing challenges with leading flux, solder and equipment suppliers who will provide their expert insight on all relevant process subjects.

Move toward the future of Smart Factory integration with line connectivity, flexible production, traceability, data analytics, process transparency/control, machine learning and real-time insight.

About KIC

KIC is a technology company working to make reflow ovens smarter through thermal profiling automation and optimization solutions. With offices across the globe, KIC is ready to become your partner in oven-based manufacturing.  Corporate headquarters are located at 16120 W Bernardo Dr., San Diego, California 92127. https://kicthermal.com.

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.



Copyright © 2020 I-Connect007. All rights reserved.