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MacDermid Alpha Electronics Solutions announced the release of M-Contact IN-2000 for sales worldwide. The M-Contact IN-2000 is an acid indium electroplating process for press-fit connector plating that is fully analyzable and easy to control. The indium deposit produced by the IN-2000 bath is naturally resistant to whiskering. With a wide current density range, greater than 90% plating efficiency over the life of the bath, and resistance to many different metallic bath contaminants, the IN-2000 is an excellent coating for any metal sub-layer.
“Fabricators that manufacture connectors, especially those for automotive applications, have been searching for ways to reduce reliance on tin finishes for many years. With the M-Contact IN-2000, we finally can offer an alternative to tin that provides a complete solution ready for specification,“ said Rich Bellemare, director for electrolytic metallization, circuitry solutions.
The M-Contact IN-2000 process is the latest expansion to the MacDermid Enthone brand family of connector plating chemistries that allows for highly customized stack combinations including copper, nickel, nickel alloys, palladium, tin, silver, gold and other precious metals.
About MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions is an Element Solutions Inc business. Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.