iNEMI Session at ICEP

Reading time ( words)

The International Conference on Electronics Packaging (ICEP) will be held on April 17-20, 2019 in Japan. iNEMI has scheduled a session at ICEP featuring results from three iNEMI projects and a report from the 2019 iNEMI roadmap. The iNEMI session is scheduled on Wednesday, April 17, room A, running from 16:40 - 18:20.

Specific topics and speakers at the session will be as follows:

  • Packaging Technology Roadmap and Electronics Manufacturing Challenges and Opportunities, Marc Benowitz (iNEMI)
  • Benchmarking of Qualification Methodologies for New Package Technologies and Materials, Feng Xue (IBM)
  • Inspection/Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages, Masahiro Tsuriya (iNEMI)
  • Molded Electronic Package Warpage Predictive Modelling Methodologies, Wei Keat Loh (Intel)

iNEMI CEO Marc Benowitz, Haley Fu and Masahiro Tsuriya, will be attending ICEP. If you would like to meet with iNEMI representatives while at the conference, please contact Masahiro Tsuriya (



Suggested Items

Foundations of the Future: Get More Engaged in 2020

01/22/2020 | Charlene Gunter du Plessis, IPC Education Foundation
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.

CyberOptics Sensors: So Good That Their Rivals Use Them

12/20/2019 | Real Time with...productronica
Editor Nolan Johnson and Subodh discuss CyberOptics’ latest precision 3D systems, such as the SQ3000, which offers AOI, SPI and CMM functionalities. The inline CMM system includes top-of-the-line software for metrology grade measurements of critical points. Subodh points out that some of his competitors even utilize CyberOptics sensors in their equipment.

Global Political Turmoil Creating Uncertainties for the Industry

11/20/2019 | Chris Mitchell, IPC Vice President of Global Government Relations
From where I sit, representing the interests of electronics manufacturers and related companies around the world, I regret to say that the future of our industry—while bright overall—is fraught with uncertainties, from trade policy disputes to government leadership turnovers and economic and social megatrends. IPC is working with all governments and parties to overcome these uncertainties, but there is a lot to tackle.

Copyright © 2020 I-Connect007. All rights reserved.