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The International Conference on Electronics Packaging (ICEP) will be held on April 17-20, 2019 in Japan. iNEMI has scheduled a session at ICEP featuring results from three iNEMI projects and a report from the 2019 iNEMI roadmap. The iNEMI session is scheduled on Wednesday, April 17, room A, running from 16:40 - 18:20.
Specific topics and speakers at the session will be as follows:
- Packaging Technology Roadmap and Electronics Manufacturing Challenges and Opportunities, Marc Benowitz (iNEMI)
- Benchmarking of Qualification Methodologies for New Package Technologies and Materials, Feng Xue (IBM)
- Inspection/Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages, Masahiro Tsuriya (iNEMI)
- Molded Electronic Package Warpage Predictive Modelling Methodologies, Wei Keat Loh (Intel)
iNEMI CEO Marc Benowitz, Haley Fu and Masahiro Tsuriya, will be attending ICEP. If you would like to meet with iNEMI representatives while at the conference, please contact Masahiro Tsuriya (email@example.com).