Ucamco Bridges the PCB Assembly Gap


Reading time ( words)

Before any electronic product reaches its final customer, it will have gone through multiple processes carried out by a series of independent specialist manufacturers who rarely communicate directly with each other. For the most part, this works, but it can be a problem for assembly companies who must put bare boards and components together. They need detailed information about both elements in order to make valid decisions about how to place components, and whether the design constraints are in line with their own manufacturing capabilities and specifications. Intelligent integrated solutions that combine data about bare boards and components are scarce or come at a premium, so many companies are using ad-hoc systems that are neither streamlined nor efficient.

With a decades-long commitment to developing leading-edge integrated production software that truly responds to and grows with the needs of the PCB manufacturing industry, Ucamco makes it a priority to listen to its customers and work closely with them. So when Ucamco was asked for help in improving assembly front-end processes, the company stepped up willingly.

“What was needed was an easy way for assembly companies to understand the PCB, identify the components and placement requirements, and see and analyse board and component characteristics,” said Ucamco’s Adam Newington.

All fairly straightforward information that should normally be provided by the design company but is not always forthcoming. As it happens, the board designers generally output this information in Gerber and/or ODB files together with the bare board data that PCB manufacturers need. It’s a data format that UcamX handles every day, all over the world, so it was a natural enough step to extend the platform to encompass assembly-specific data management.

UcamX Assembly Seat identifies the assembly data and reads it into a job database, putting it into an easily understandable visual format that can be interrogated, zoomed in on, collated and analysed to clarify quickly and easily exactly what the assembly process requires, while annular ring and solder pad land sizes and clearances can be analysed to see how they impact assembly. UcamX Assembly Seat allows interrogation of components singly and by type, reference designator information or part name, PIN numbers and reference net names. Components, connections and net designators can be traced back to the designer’s original schematic, and BOMs and production documents can easily be generated. And there is potential for a whole lot more functionality.

Ucam has been facilitating front-end PCB manufacturing processes for decades. Now, with UcamX Assembly Seat, this powerful front-end electronics manufacturing solution takes a momentous first step across the PCB-assembly bridge, supporting assembly companies with intelligent, integrated functionality, all delivered with Ucamco’s trademark ease of use and simplicity.

Find out why PCB manufacturers all over the world turn to Ucamco for solutions they can trust, and discover what UcamX Assembly Seat can do for your assembly business.

About Ucamco

Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photoplotting and direct imaging systems, with a global network of sales and support centers. Headquartered in Gent, Belgium, Ucamco has over 35 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp (1998).

For more information, please visit www.ucamco.com.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.