MacDermid Alpha to Promote High-Rel Die Attach Solutions at PCIM


Reading time ( words)

The Assembly division of MacDermid Alpha Electronics Solutions will showcase its range of high-reliability die attach solutions, including ALPHA Argomax Silver Sinter Technology, at the PCIM exhibition in Nuremberg, Germany from the May 7-9, 2019.

During the show, Gyan Dutt, Global Portfolio Manager, Die Attach Assembly for MacDermid Alpha, will be presenting on the “Thermal Resistance of Interconnect Layers in Inverter Power Assembly Stacks“ at the PCIM Conference. “The increasing adoption of wide band gap semiconductors, along with the increasing current density within the power modules in traction inverters, has led to the thermal impedance of the stack becoming more important“ comments Gyan. "The paper presentation will look at the role of interconnects in power assembly stacks and how this effects the overall thermal resistance.“

ALPHA Argomax  Silver Sinter Technology, which has been specially developed for die attach, package attach and substrate-heat spreader attach in traction inverters and other high voltage applications, provides a dramatic reduction in thermal resistance and inductance.

“The ALPHA Argomax technology creates extremely high thermal and electrical conductivity silver bonds“, explains Julien Joguet, Global Business Market Manager. Die Attach at MacDermid Alpha. “The high thermal conductivity delivered by ALPHA Argomax enables individual die to handle much higher levels of current, reducing the total number of die required, and providing the highest levels of efficiency. ALPHA Argomax also provides an unprecedented increase in die attach reliability, more than 30x higher than traditional solder methods.“

ALPHA Argomax is available in paste, film and preform material types and solutions from Ag, Au and Cu surface finishes for unparalleled flexibility. To speak to one of our technology experts visit MacDermid Alpha in Hall 7 Booth 518 at the PCIM exhibition or visit the Alpha website.

About PCIM

Date: Tuesday 7th – Thursday 9th May
Location:  Nuremberg, Germany

PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Exhibitors from across the globe will present the newest products, trends and developments in the power electronics industry. PCIM Europe is the forum for technologies for the whole value chain of the power electronics industry from the components to the intelligent system.

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.

Share

Print


Suggested Items

Ross Berntson: Indium Corporation’s Pledge for Safe Resumption Post-COVID

05/22/2020 | Nolan Johnson, I-Connect007
On May 20, Nolan Johnson spoke with Ross Berntson, Indium Corporation’s president and COO, about the company’s response to the COVID-19 outbreak. Berntson details the company's work with a consortium of manufacturing businesses in central New York state, developing a manufacturing pledge to keep people safe and keep factories running. Indium Corporation has been one of the frontrunners in formalizing such procedures and in sharing lessons learned among all the participating companies.

IPC’s Shawn Dubravac: COVID-19 Outbreak Accelerates Industry Shifts Already Under Way

05/21/2020 | Barry Matties, I-Connect007
On May 19, Barry Matties spoke with Shawn Dubravac, chief economist for IPC. While discussing other topics, Matties asked for Dubravac’s perspective on shifts in the market, who observed that the recessionary trend might be behind us; the markets are already showing recovery. Still, it could take a year or so to fully recover.

Happy’s Smart Factory Protocol Primer

04/29/2020 | Happy Holden, I-Connect007
The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article by Happy Holden surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.



Copyright © 2020 I-Connect007. All rights reserved.