TT Electronics Introduces Thermal Jumper Chip for Enhanced Temperature Rise Management


Reading time ( words)

TT Electronics, a global provider of engineered electronics for performance critical applications, announced the introduction of the TJC series thermal jumper chips, enabling circuit designers to manage temperature rise in compact power electronic assemblies. These parts provide a thermally conductive pathway with electrical isolation for management of PCB hotspot areas. Aluminium nitride, which has nearly five times the thermal conductivity of alumina, is employed in the thermal jumper chip to keep compact electronic assemblies cooler which enhances product reliability.

“There is a growing demand for compact high power assemblies that require board-level thermal management,” said Stephen Oxley, Senior Resistors Engineer, Applications and Marketing, TT Electronics. “TT is the only global resistor manufacturer offering this technology to tackle thermal instability in high power density designs.”

The TJC series boasts greater thermal conductivity than the equivalent footprint of 70µ copper, and therefore gives better thermal connection than an uninterrupted trace. The component’s compact mass and design (available in a case size as small as 0603) minimises PCB area and total assembly size and weight. These features are particularly suitable for power supplies, power amplifiers, RF amplifiers, and high power laser diode applications that may be found in the aerospace, medical, and industrial markets.

Share

Print


Suggested Items

Joe Fjelstad Breaks Down His Occam Process

03/04/2020 | I-Connect007 Editorial Team
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

Stencils: Not As Simple As They Seem

02/26/2020 | I-Connect007 Editorial Team
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

The Convergence of 5G and Automotive

01/08/2020 | Barry Matties, I-Connect007
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.