Amerway Adds Capability with New Continuous Casting Machine


Reading time ( words)

Amerway Inc. has boosted its production capabilities with the installation of a new ‘Continuous Casting’ machine at the company’s Beale Avenue manufacturing facility in Altoona, Pennsylvania. The new machine, with its innovative circular ‘casting wheel’ design, speeds up production capabilities for Amerway solder bar and wire products.

In making the announcement, Terry Buck, president, said, “We’re pleased to have this new capability up and running in-house now, because it improves lead times for all orders, especially large orders. It can generate on average 2,000 lbs. an hour of alloy products, depending on the alloy, and of course that means lead-free. Its design prevents cross-contamination of alloys so that our customers not only receive their products fast and on time, but they can also be assured of its absolute purity.”

Tim Brown, Sales Manager, added that “This machine utilizes a single-cast operation, reducing the cost of manufacturing and that includes labor and press expenses. Its greater capability frees up press time for other products, and thereby reduces lead times across the board for all Amerway products.”

Amerway manufactures a large selection of lead-free alloys and metals products including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more, in Altoona, Pennsylvania, conveniently in the eastern United States,  Amerway holds ISO 9001 quality certification.

About Amerway

Amerway Inc., based in Altoona, Pennsylvania, USA, is a premier supplier of solder bar, solder wire, fluxes, and custom alloy products to the electronics manufacturing industry. Amerway manufactures a large selection of lead-free alloys including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more.

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.



Copyright © 2019 I-Connect007. All rights reserved.