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TopLine will exhibit at NASA’s 2019 Single Event Effects (SEE) Symposium and Military and Aerospace Programmable Logic Devices (MAPLD) Workshop, to be held May 21-22 at the La Jolla Marriott. TopLine’s participation in the symposium is the first for the company, according to TopLine CEO Martin Hart.
“TopLine is excited to be exhibiting for the first time at SEE/MAPLD,” he said. “ We will be at this conference and workshop to meet with aerospace industry leaders to discuss and illustrate the benefits of our compliant solder columns for FPGA devices and other innovative TopLine solutions.”
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, visit www.Topline.tv/CCGA.html.
NASA combined the SEE Symposium and MAPLD in 2011 creating a dynamic event that attracts 200 attendees from the worldwide RadHard community. Attendees range from government agencies NASA, JPL, NRL, and others to prominent industry suppliers.
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.