TopLine Exhibiting at NASA’s SEE/MAPLD Workshop


Reading time ( words)

TopLine will exhibit at NASA’s 2019 Single Event Effects (SEE) Symposium and Military and Aerospace Programmable Logic Devices (MAPLD) Workshop, to be held May 21-22 at the La Jolla Marriott. TopLine’s participation in the symposium is the first for the company, according to TopLine CEO Martin Hart.

“TopLine is excited to be exhibiting for the first time at SEE/MAPLD,” he said. “ We will be at this conference and workshop to meet with aerospace industry leaders to discuss and illustrate the benefits of our compliant solder columns for FPGA devices and other innovative TopLine solutions.”

TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, visit www.Topline.tv/CCGA.html.

NASA combined the SEE Symposium and MAPLD in 2011 creating a dynamic event that attracts 200 attendees from the worldwide RadHard community.  Attendees range from government agencies NASA, JPL, NRL, and others to prominent industry suppliers. 

About TopLine 

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. 

 

Share

Print


Suggested Items

Zentech's Mission-critical Tips for Program Success

05/03/2019 | Nolan Johnson, I-Connect007
Nolan Johnson and John Vaughan, I-Connect007 columnist and VP of sales and marketing at Zentech Manufacturing, discuss how to make customer programs successful through early communication, complete design packages, and more from a company servicing mission- and life-critical industries, including military, aerospace, and medical.

A Young Engineer’s Perspective

04/15/2019 | Barry Matties, I-Connect007
Jeffrey Diament, a recent Princeton University graduate and an engineering associate from sensor manufacturer Instrumems, talks about the company’s nanowire sensing platform that can measure velocity, temperature, and humidity. Being his first career job out of college, Diament discusses his experience on the hardware and manufacturing side of things and offers advice to other young professionals.

IPC Working to Revive Lead-Free R&D in High-Reliability Sectors

04/10/2019 | Chris Mitchell, IPC VP, Global Government Relations
Ask yourself the following question: Why is it that the aerospace, defense and high performance (ADHP) electronics sectors remain reliant on lead solders and components even as the commercial sector has largely phased out their use?



Copyright © 2019 I-Connect007. All rights reserved.