TopLine Exhibiting at NASA’s SEE/MAPLD Workshop

Reading time ( words)

TopLine will exhibit at NASA’s 2019 Single Event Effects (SEE) Symposium and Military and Aerospace Programmable Logic Devices (MAPLD) Workshop, to be held May 21-22 at the La Jolla Marriott. TopLine’s participation in the symposium is the first for the company, according to TopLine CEO Martin Hart.

“TopLine is excited to be exhibiting for the first time at SEE/MAPLD,” he said. “ We will be at this conference and workshop to meet with aerospace industry leaders to discuss and illustrate the benefits of our compliant solder columns for FPGA devices and other innovative TopLine solutions.”

TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, visit

NASA combined the SEE Symposium and MAPLD in 2011 creating a dynamic event that attracts 200 attendees from the worldwide RadHard community.  Attendees range from government agencies NASA, JPL, NRL, and others to prominent industry suppliers. 

About TopLine 

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. 




Suggested Items

Juan Arango on Koh Young’s New U.S. Headquarters

10/27/2019 | Andy Shaughnessy, I-Connect007
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

Copyright © 2019 I-Connect007. All rights reserved.