Yamaha Unveils Manufacturing Solutions at SMT Connect 2019

Reading time ( words)

At SMT Connect 2019 in Nuremberg, Yamaha Motor Europe SMT Section revealed more details of new surface-mount equipment and software tools joining the Yamaha Total Line Solution to boost productivity and quality.

“Europe’s high-tech sector is extremely active right now and we met many visitors engaged in ongoing projects seeking solutions to specific challenges,” said Ichiro Arimoto. “We introduced important innovations throughout our Total Line Solution that are designed to overcome the challenges they are facing.”

Yamaha’s latest equipment line-up now adds the YSP10 screen printer with next-generation automated features. Seen for the first time in Europe at SMT Connect, the YSP10 eliminates human intervention from product changeovers by automatically changing the program, stencil, and support pins and recovering unused solder paste. Yamaha technical specialists showed how this advanced automation cuts changeover time from several minutes to about 70 seconds. 510mm x 510mm maximum board size tackles today’s toughest challenges such as large display-backlight panels and industrial boards.

Alongside the YSP10, Yamaha also showcased the latest in high-speed mounting with the enhanced YSM20R. Introducing 0201-chip component-placement capability, the YSM20R also delivers a 5% speed boost leveraging faster X-Y axis speeds. Further innovations include fully automated feeder and tray exchange that cut downtime during changeovers or replenishment to the bare minimum.

With the latest YSi-SP, dedicated to solder-paste inspection, Yamaha’s proven 3D vision expertise further enhances quality assurance. Advanced features include proprietary high-speed vision algorithms and selective super-high resolution to tackle challenging areas containing small or densely-spaced pads.

In addition, enhancements to the YSi-V post-placement AOI system include a full-HD LCD touch panel with enhanced navigation to maximise the combination of the YSi-V’s12Mpixel camera and exclusive image-capture technology for super-accurate inspection capability.

Visitors also discovered two new features of Yamaha’s Factory Tools 4.0 software suite. The powerful new Dashboard shows current status and historical line data with depth and clarity, while the innovative Image Viewer greatly accelerates visual analysis and troubleshooting. By simply clicking on a Dashboard item, users can call up digital images from any camera onboard the printer, mounters, SPI and AOI in each line.

Completing the enhancements presented at SMT Connect, upgrades to the YST15 intelligent component-storage system enhance job preparation with new automated features that assist program optimisation and reserve needed components in inventory.

About Yamaha SMT Section

Yamaha Surface Mount Technology (SMT) Section is a subdivision of Yamaha Motor Robotics Business Unit in Yamaha Motor Corporation. Yamaha surface mount equipment is highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.

Yamaha SMT Section has created a strong business in the surface mount industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, 3D solder paste inspection, 3D PCB inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha SMT Section to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.

Yamaha SMT Section has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients.



Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Copyright © 2019 I-Connect007. All rights reserved.