TopLine Sees Growth at Space Tech Expo

Reading time ( words)

TopLine CEO Martin Hart and TopLine staff experienced first-hand the growing aerospace industry when they exhibited products from three different technologies at the recent Space Tech Expo in Pasadena, California. The Space Tech expo is considered the leading showcase of space-related technologies and innovations from systems and sub-systems, components, testing and manufacturing technologies for civil, military and commercial space applications.

“We noted an increased number of exhibitors and attendees at this year’s SpaceTech Expo,” Hart said, “a positive sign of growth in these industries served by TopLine. We also saw increased interest in our reliability solutions for components and assemblies.” TopLine has exhibited at the expo for several years and plans to exhibit next year as well, in May 2020 in Long Beach, California.

This year, TopLine featured its innovative CCGA column grid arrays, covering FPGA packages for defense and aerospace. Solder columns are used to reliably connect FPGA devices to printed circuit boards. Columns absorb stress caused by CTE coefficient of thermal expansion between ceramic packages and the PCB.

TopLine also exhibited its PID (Particle Impact Damper) technology, designed to cancel extreme random vibrations in printed circuit boards. PID technology was developed by engineers at NASA Marshall Space Flight Center.

TopLine also exhibited its range of Bonding Wire for connecting silicon die to packages in microelectronics. TopLine provides a full range of Gold, Aluminum, Silver and Copper wire in round and flat ribbon formats. More information for all three technologies is available at

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.  



Suggested Items

Goepel electronic Solutions, Webinar Series, and Trends

06/19/2019 | Barry Matties, I-Connect007
Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Reflow Your Solder and Your Data for Industry 4.0

06/11/2019 | Nolan Johnson, I-Connect007
I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.

Copyright © 2019 I-Connect007. All rights reserved.